Modern Solder Technology for Competitive Electronics Manufacturing

Achieving Competitive Advantages of Advanced Manufacturing Technology

Solder Joints in Electronics: Design for Reliability

The emerging new technologies provide ever more challenges to assure the reliability of electronic products. The ever increasing demands in electronic products for higher performance, lower cost, less space (weight) is leading to ever denser interconnection needs. This makes solder joint reliability an even more important issue with the advent of new surface mount packages and the use of surfac...

Electronics Manufacturing

The electronics industry includes: the manufacture of: passive components (resistors, capacitors, inductors); semiconductor components (discretes, integrated circuits); printed circuit boards (single and multilayer boards); and printed wiring assemblies. This document addresses the environmental issues associated with the latter three manufacturing processes. The manufacturing of passive compon...

Information Technology Governance in the Malaysian Electronics Manufacturing Industry

Research indicates that information technology (IT) governance is attracting enormous attention from practitioners and academics. This is fueled by the growing importance of IT governance in the delivery of IT compliance and in its ability to create value for businesses. IT compliance minimizes risk while IT governance manages risks. This paper is a preliminary report on an electronic survey of...

Stacked solder bumping technology for improved solder joint reliability

Reliability in flip chip and Ball Grid Array is a major concern. Solder joint geometry is extremely important from a reliability point of view. Commonly, the flip chip solder bump takes on the shape of a spherical segment. Mathematical calculations and finite element modeling have shown that the hourglass-shaped solder bumps experience the lowest plastic strain and have the longest lifetime. In...